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Istituto per la Microelettronica e Microsistemi     
Impronta M. P., Marras A., De M. I., Scorzoni A., Valentini M. Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach. In: 2007 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT) (Barga, Italy, July 28 - August 3 2007). Proceedings, vol. 8 pp. 157 - 162. ECS transactions, 2007.
 
 
Abstract
(English)
ECI Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors (ULSIC vs TFT)
URL: http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=ECSTF8000008000001000157000001&idtype=cvips&gifs=yes
DOI: 10.1149/1.2767302
Subject Electromigration


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